EB-Data
 2D-stacks
   

 E-Series - Stacks, Active Cooling

The DILAS E-series devices encompass all configurations which consist of a number of vertically stacked, actively cooled HPDL-elements (chip on micro cooler) that are electrically connected in serial.

Operating conditions can be CW or QCW for the EN and EY types and CW for the EB type. The extremely efficient cooling permits duty factors up to 50% at nearly maximum output power levels.

The EY and EB versions are provided either with dust protective housing or with hermetically sealed housing and an AR-coated window, which are optional for the EN version. In addition to the standard models we can provide custom devices to fit specific requirements for interfaces, beam propagation, mechanical dimensions, etc.